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A method for producing a dielectric thick film structure or of a thick film - copper conductor
A method for producing a dielectric thick film structure or of a thick film - copper conductor
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机译:用于制造介电厚膜结构或厚膜-铜导体的方法
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摘要
An improved method of fabricating thick film dielectrics and copper conductors comprises depositing and drying an appropriate thick-film ink, treating the resulting patterned layer with a carbon dioxide plasma until substantially all of the organic vehicle is removed therefrom and then firing the layer in an inert atmosphere. In an alternate embodiment, a dried dielectric ink is initially treated with an oxygen plasma until about 75 to 99 percent of the vehicle is removed. Multilayer copper-based circuit structure fabricated utilizing the subject method are characterized by excellent integrity of the dielectric layers.
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