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METHOD FOR ADJUSTING MECHANICAL IMPACT FORCE IN PROCESSING ELECTRONIC CHIP PARTS AND MECHANICAL IMPACT FORCE SENSOR
METHOD FOR ADJUSTING MECHANICAL IMPACT FORCE IN PROCESSING ELECTRONIC CHIP PARTS AND MECHANICAL IMPACT FORCE SENSOR
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机译:调整电子芯片零件中的机械冲击力的方法和机械冲击力传感器
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摘要
PURPOSE:To derive impact force which electronic chip parts receive by an exact value and to surely prevent the generation of a physical failure of the electronic chip parts caused by impact by providing a mechanical impact force sensor consisting of the same shape as the electronic chip parts and having piezoelectric property. CONSTITUTION:First of all, the mechanical impact force sensor 1 which consists of the same shape as electronic chip parts and has a piezoelectric property is prepared, and the sensor 1 is inserted into the recessed part 10 of a base 6. Subsequently, a measuring terminal 7 and a measuring terminal 8 are moved to the upper part and the lower part, respectively, and both the measuring terminals 7, 8 are allowed to abut on the external electrode 3 of the sensor 1. By impact force in this case, a voltage corresponding to whether the impact force is large or small is generated in the sensor 1. This output voltage is measured and recorded by the oscilloscope of a measuring instrument 9 through the measuring terminals 7, 8. Subsequently, the peak value of the output voltage generated first is converted to impact force by using a piezoelectric constant measured in advance with regard to the sensor 1, and impact force generated due to a fact that the measuring terminals 7, 8 abut on the sensor 1 at the time of measurement is derived. In such a way, the generation of a physical failure of the electronic chip parts caused by an impact can be prevented surely.
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