首页> 外国专利> METHOD FOR ADJUSTING MECHANICAL IMPACT FORCE IN PROCESSING ELECTRONIC CHIP PARTS AND MECHANICAL IMPACT FORCE SENSOR

METHOD FOR ADJUSTING MECHANICAL IMPACT FORCE IN PROCESSING ELECTRONIC CHIP PARTS AND MECHANICAL IMPACT FORCE SENSOR

机译:调整电子芯片零件中的机械冲击力的方法和机械冲击力传感器

摘要

PURPOSE:To derive impact force which electronic chip parts receive by an exact value and to surely prevent the generation of a physical failure of the electronic chip parts caused by impact by providing a mechanical impact force sensor consisting of the same shape as the electronic chip parts and having piezoelectric property. CONSTITUTION:First of all, the mechanical impact force sensor 1 which consists of the same shape as electronic chip parts and has a piezoelectric property is prepared, and the sensor 1 is inserted into the recessed part 10 of a base 6. Subsequently, a measuring terminal 7 and a measuring terminal 8 are moved to the upper part and the lower part, respectively, and both the measuring terminals 7, 8 are allowed to abut on the external electrode 3 of the sensor 1. By impact force in this case, a voltage corresponding to whether the impact force is large or small is generated in the sensor 1. This output voltage is measured and recorded by the oscilloscope of a measuring instrument 9 through the measuring terminals 7, 8. Subsequently, the peak value of the output voltage generated first is converted to impact force by using a piezoelectric constant measured in advance with regard to the sensor 1, and impact force generated due to a fact that the measuring terminals 7, 8 abut on the sensor 1 at the time of measurement is derived. In such a way, the generation of a physical failure of the electronic chip parts caused by an impact can be prevented surely.
机译:目的:通过提供一个具有与电子芯片零件相同形状的机械冲击力传感器,来得出电子芯片零件受到的冲击力的精确值,并确保防止由于冲击而导致的电子芯片零件物理故障的产生并具有压电特性。组成:首先,准备机械冲击力传感器1,该传感器具有与电子芯片部件相同的形状,并具有压电特性,并将传感器1插入底座6的凹入部分10中。随后进行测量端子7和测量端子8分别移动到上部和下部,并且两个测量端子7、8都允许抵靠在传感器1的外部电极3上。在传感器1中产生与冲击力是大还是小相对应的电压。该输出电压由测量仪器9的示波器通过测量端子7、8进行测量和记录。随后,输出电压的峰值通过预先对传感器1测量的压电常数将首先产生的冲击力转换为冲击力,并且由于测量端子7、8紧靠传感器1的事实而产生的冲击力在测量时得出。以这种方式,可以可靠地防止由冲击引起的电子芯片部件的物理故障的产生。

著录项

  • 公开/公告号JPH01150829A

    专利类型

  • 公开/公告日1989-06-13

    原文格式PDF

  • 申请/专利权人 MURATA MFG CO LTD;

    申请/专利号JP19870310133

  • 发明设计人 OKUBO SHINICHI;BANDAI HARUFUMI;

    申请日1987-12-07

  • 分类号G01R31/00;G01L5/00;H01C17/00;H01F41/00;H01G13/00;H05K13/04;

  • 国家 JP

  • 入库时间 2022-08-22 06:47:51

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