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METHOD OF CONTROLLING FORBIDDEN BAND WIDTH OF SEMICONDUCTOR SUPERLATTICE

机译:半导体超晶格禁带宽度的控制方法

摘要

PURPOSE:To facilitate varying the forbidden band width of a compound semiconductor superlattice containing As continuously and forming parts which have forbidden band widths different from each other selectively in one substrate by a method wherein an insulating layer which is to be a passivation film is formed on a part of the surface of a semiconductor layer structure including the compound semiconductor superlattice and the layer structure is subjected to a heat treatment under an As4 pressure and the type of the insulating layer and the As4 pressure are varied. CONSTITUTION:An n-type Al0.3Ga0.7As cladding layer 2, an MQW active layer 3, a p-type Al0.3Ga0.7As cladding layer 4 and a p-type GaAs contact layer 5 are successively built up on an n+type GaAs substrate 1 by a molecular beam epitaxy(MBE) method to form a layer structure. An SiN layer is formed on a part of the surface of the layer structure as a passivation film 6 and the layer structure is subjected to a heat treatment in a sealed tube under an arsenic pressure about 20Torr. As a result, in the region to which the arsenic pressure is directly applied, passivation conditions given by the arsenic pressure are degraded and PL is shifted to 770-780nm. The shift rate of PL can be selected arbitrarily within a range about 760-810nm continuously by varying the arsenic pressure. On the other hand, the passivation effect of the SiN layer functions remarkably in the region under the passivation film and PL of a super-lattice is not varied so much and is 810-820nm so that the forbidden band width in this region can be reduced by the value corresponding to PL about 40nm.
机译:用途:为了便于连续地改变包含As的化合物半导体超晶格的禁带宽度,并通过一种方法在其中形成选择性地在一个基板中具有互不相同的禁带宽度的部分,在该方法中,形成要作为钝化膜的绝缘层在As4压力下对包括化合物半导体超晶格和层结构的半导体层结构的表面的一部分进行热处理,并且改变绝缘层的类型和As4压力。组成:n型Al0.3Ga0.7As包层2,MQW有源层3,p型Al0.3Ga0.7As包层4和p型GaAs接触层5依次构建在n <通过分子束外延(MBE)方法对GaAs衬底1进行+型形成层结构。在层结构的表面的一部分上形成SiN层作为钝化膜6,并且在约20Torr的砷压力下在密封管中对该层结构进行热处理。结果,在直接施加砷压力的区域中,由砷压力给定的钝化条件降低,并且PL转移到770-780nm。通过改变砷压力,可以在大约760-810nm的范围内连续选择PL的移动速率。另一方面,SiN层的钝化效果在钝化膜下方的区域中显着起作用,并且超晶格的PL变化不大并且为810-820nm,从而可以减小该区域中的禁带宽度。通过对应于PL约40nm的值。

著录项

  • 公开/公告号JPS6459978A

    专利类型

  • 公开/公告日1989-03-07

    原文格式PDF

  • 申请/专利权人 FUJITSU LTD;

    申请/专利号JP19870217503

  • 发明设计人 MAKIUCHI MASAO;FURUYA AKIRA;WADA OSAMU;

    申请日1987-08-31

  • 分类号H01L21/324;H01L31/10;H01S5/00;H01S5/343;

  • 国家 JP

  • 入库时间 2022-08-22 06:41:35

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