THICK FILM MULTILAYER INTERCONNECTION SUBSTRATE

摘要

PURPOSE:To make a conductor layer uniform in thickness by a method wherein a peripheral stepped section of a thick insulating layer which a conductor layer traverses is constructed in such a manner that an upper layer is so laminated as to recede inside from the edge of a lower layer by a certain space which is equal to or larger than its thickness. CONSTITUTION:A conductor pattern 12 and an insulating layer 14 composed of two thick films are provided onto an insulating substrate 11. The insulating layer 13 is formed on a peripheral stepped section, on which a conductor layer 14 is to be formed, in such a manner that an insulating layer 13b is so formed as to recede from the edge of an insulating layer 13a by a distance l1 which is equal to or larger than its thickness. In this structure, the conductor layer 14 which traverses the peripheral section is so formed as to make its stepped section 14a almost equal to the other section in thickness, and thus a molten solder can be coated on the stepped section 14a.