Thick film multilayer interconnection substrate

摘要

P To provide a thick film multilayered wiring board capable of miniaturization and high density of a wiring board. PSOLUTION: In a thick-film multilayer wiring board 1 mounted with chip electronic components 10 ON the thick-film multilayer wiring board 1 obtained by laminating an Ag conductor 4, a thick-film resistor 7, and an insulating layer 3 ON a ceramic insulating board 2, the thick-film resistor 7 is divided into an inner layer and a surface layer and is formed to be capable of resistance trimming. Further and the inner layer thick-film resistor 7a and the surface layer thick-film resistor 7b are connected in parallel and in series. PCOPYRIGHT: (C)2004 and JPO