Glass-ceramic substrates for electronic packaging and thermally crystallizable glass compositions of use in the production thereof

摘要

This invention is directed to the preparation of glass-­ceramic materials especially suitable for use in multilayer substrates for integrated circuit packages. The inventive glass-ceramics are derived from thermally crystallizable glasses which, in the form of frit, are capable of being sintered into an integral body at temperatures below 1000°C and essentially concurrently crystallized in situ to yield BPO₄ as the predominant crystal phase. The inventive glass-­ceramics exhibit a linear coefficient of thermal expansion between about 30-45 x 10⁻⁷/°C, a dielectric constant less than 5, and consist essentially, in weight percent, of 10-25% B₂O₃, 20-40% P₂O₅, and 50-65% SiO₂.