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Glass-ceramic substrates for electronic packaging and thermally crystallizable glass compositions of use in the production thereof
Glass-ceramic substrates for electronic packaging and thermally crystallizable glass compositions of use in the production thereof
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机译:用于电子包装的玻璃陶瓷基材和在其生产中使用的可热结晶的玻璃组合物
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摘要
This invention is directed to the preparation of glass-ceramic materials especially suitable for use in multilayer substrates for integrated circuit packages. The inventive glass-ceramics are derived from thermally crystallizable glasses which, in the form of frit, are capable of being sintered into an integral body at temperatures below 1000°C and essentially concurrently crystallized in situ to yield BPO₄ as the predominant crystal phase. The inventive glass-ceramics exhibit a linear coefficient of thermal expansion between about 30-45 x 10⁻⁷/°C, a dielectric constant less than 5, and consist essentially, in weight percent, of 10-25% B₂O₃, 20-40% P₂O₅, and 50-65% SiO₂.
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机译:本发明涉及玻璃陶瓷材料的制备,该玻璃陶瓷材料特别适用于集成电路封装的多层基板。本发明的玻璃陶瓷衍生自可热结晶的玻璃,该玻璃以玻璃料的形式能够在低于1000°C的温度下烧结成一个整体,并能在原位同时结晶 U>产生BPO 3作为主要的结晶相。本发明的玻璃陶瓷的线性热膨胀系数在约30-45×10 -4℃之间,介电常数小于5,并且基本上由10-25%的B 2 O 3组成,重量比为20-40。 %的P 2 O 3和> 50-65%的SiO 2。
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