Method and device for the embodiment and the positioning of an intermediate separation of objects that juxtaposed to be packaged, and intermediate packaging

• 1. 软包装材料容器用中间件的制造方法、软包装材料容器的制造方法和软包装材料容器包装体的制造方法 [P] . 中国专利： CN110382220A . 2019-10-25
• 2. 用于将松散物品包装在单元装载包装件中的方法及其包装件 [P] . 中国专利： CN1040415C . 1998.10.28
• 3. Method and device for the realization and the placement of an interleaver separation of juxtaposed objects to be packaged; packaging process juxtaposed with interposer objects apart. [P] . ES2022431B3 . 1991-12-01

  机译： 用于实现并放置要包装的并置对象的交织器分离的方法和装置;包装过程中，插入物对象分开放置。

• 4. Method and machine for the embodiment of packaging bags that juxtaposed, and assembly of packaging bags that juxtaposed [P] . 法国专利： FR2726784B1 . 1996-12-27

  机译： 用于并置的包装袋的实施例的方法和机器，以及并置的包装袋的组装

• 5. Method and device for producing and placing a spacer sheet between juxtaposed objects to be packed; method for packaging juxtaposed objects with a spacer sheet [P] . 欧洲知识产权局专利： EP0276619B1 . 1991-03-20

  机译： 在将要包装的并置物品之间生产和放置隔离片的方法和装置;用间隔片包装并置物体的方法

• 1. Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter Extraction Method [J] . Young-Min, Yoon, No-Su, 测试科学与仪器：英文版 . 2010,第0S1期
• 2. A METHODOLOGY FOR DEFINING INTERMEDIATE LEVEL WASTE PACKAGE CHARACTERISTICS THAT ENSURE CRITICALITY SAFETY IN A GEOLOGICAL DISPOSAL FACILITY [C] . Tim Hicks, Slimane Doudou, Robert Winsley International Conference on Nuclear Criticality Safety . 2016
• 3. Quality inspection and reliability study of solder bumps in packaged electronic devices: Using laser ultrasound and finite element methods [D] . Yang, Jin 2008
• 4. Localization of adenovirus morphogenesis players together with visualization of assembly intermediates and failed products favor a model where assembly and packaging occur concurrently at the periphery of the replication center [O] . Gabriela N. Condezo, Carmen San Martín 2017
• 5. Graphical Introduction of Interconnect and Packaging Technologies for Optoelectronic Devices 8). Alignment, a Synonym of an Optoelectronic Device Packaging. [O] . Masataka ITOH 1998
• 6. Requirements and methods for low and intermediate level waste package acceptability [R] . 1996

• 1. High Performance Hydrophobic Interaction Chromatography-A New Approach to Separate Intermediates of Protein Folding──Ⅰ.Separation of Intermediates of Urea-unfolded α-Amylase [J] . Quan BAI ,Yin Mao WEI ,Ming Hui GENG . 中国化学快报：英文版 . 1997,第1期
• 2. On the Embodiment of “Plain and Elegance” on the Tea Packages [J] . 徐岸英 . 海外英语(上) . 2012,第001期
• 3. STUDY OF DEGRADATION MECHANISM AND PACKAGING OF ORGANIC LIGHT EMITTING DEVICES [J] . Gu Xu Materials Science and Engineering McMaster University Hamilton Ontario L8S 4L7 Canada . 高分子科学：英文版 . 2003,第5期
• 4. 应用Object Packager获取Windows图标 [J] . 曾宏清 . 电脑技术信息 . 1997,第008期
• 5. 云计算在中间件领域落地——中创软件中间件打造全新的InforSuite云服务中间件平台 [C] . . 2010电力行业信息化年会 . 2010
• 6. 消息中间件在Web服务中的应用及面向Web服务的消息中间件设计 [A] . 徐远芳 . 2004