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Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization
Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization
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机译:制备用于从有机金属蒸气中沉积金属种子以用于随后的化学镀金属的基板的方法
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摘要
A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer. Volatile organopalladium compounds, such as (cyclopentadienyl)(allyl)palladium and bis(allyl)pallidium, are particularly effective for depositing a palladium seed which is particularly effective for electroless deposition of copper.
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