首页> 外国专利> HARDNING POLYSICYCLOSLEFINE RESIN SOLUTION ITS USE IN MANUFACTURING OF PRINTED CIRCUIT BOARD,AND PRINTED CIRCUIT BOARD WHICH IS MANUFACTURED IN SUCH WAY

HARDNING POLYSICYCLOSLEFINE RESIN SOLUTION ITS USE IN MANUFACTURING OF PRINTED CIRCUIT BOARD,AND PRINTED CIRCUIT BOARD WHICH IS MANUFACTURED IN SUCH WAY

机译:硬化多环芳烃树脂溶液在印制电路板和以这种方式制造的印制电路板的制造中的用途

摘要

PURPOSE: To obtain a stable nonconductive substrate by immersing the substrate in polycycloolefin solution in organic solvent and laminating the dried substrate with a conductive foil so as to harden into a solvent insoluble state. CONSTITUTION: The first polymerization of a stiffener is added to a composition after finish and next, a proper substrate, a glass fiber cloth, e.g. is impregnated by about 80:20 to 30:70 by the weight of polycycloolefin (solid state) to a base. A solvent is removed by evaporation at a temperature not more than an activating temperature of the stiffener. Next, the impregnated substrate is laminated with a conductive foil and polycycloolefin crosslinks into an insoluble state to activate the stiffener to show a grass transition temperature over 90 deg.C. A circuit board obtained like this is satisfactory in a dielectric constant and dielectric tangent. Thereby a stable print circuit board showing a physical characteristic satisfactory in a low solvent swelling degree, a low linear expansion coefficient, etc., is manufactured by this.
机译:目的:通过将基板浸入有机溶剂中的聚环烯烃溶液中,然后将干燥的基板与导电箔层压在一起,使其硬化成不溶于溶剂的状态,从而获得稳定的非导电基板。组成:硬化剂的第一次聚合反应在完成后添加到组合物中,然后添加合适的基材,玻璃纤维布,例如以聚环烯烃(固态)的重量计,其以约80:20至30:70的浓度浸渍到碱中。通过在不大于加固件的活化温度的温度下蒸发除去溶剂。接下来,将浸渍的基材与导电箔层压,并且聚环烯烃交联成不溶状态以活化增强剂,以显示超过90℃的草转变温度。这样获得的电路板的介电常数和介电正切是令人满意的。由此,制造出显示出在低溶剂溶胀度,低线性膨胀系数等方面令人满意的物理特性的稳定的印刷电路板。

著录项

  • 公开/公告号JPH02198190A

    专利类型

  • 公开/公告日1990-08-06

    原文格式PDF

  • 申请/专利权人 B F GOODRICH CO:THE;

    申请/专利号JP19890248983

  • 申请日1989-09-25

  • 分类号B32B15/08;C08G61/06;C08G61/08;C08J5/24;H05K1/03;

  • 国家 JP

  • 入库时间 2022-08-22 06:24:38

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