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HARDNING POLYSICYCLOSLEFINE RESIN SOLUTION ITS USE IN MANUFACTURING OF PRINTED CIRCUIT BOARD,AND PRINTED CIRCUIT BOARD WHICH IS MANUFACTURED IN SUCH WAY
HARDNING POLYSICYCLOSLEFINE RESIN SOLUTION ITS USE IN MANUFACTURING OF PRINTED CIRCUIT BOARD,AND PRINTED CIRCUIT BOARD WHICH IS MANUFACTURED IN SUCH WAY
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机译:硬化多环芳烃树脂溶液在印制电路板和以这种方式制造的印制电路板的制造中的用途
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摘要
PURPOSE: To obtain a stable nonconductive substrate by immersing the substrate in polycycloolefin solution in organic solvent and laminating the dried substrate with a conductive foil so as to harden into a solvent insoluble state. CONSTITUTION: The first polymerization of a stiffener is added to a composition after finish and next, a proper substrate, a glass fiber cloth, e.g. is impregnated by about 80:20 to 30:70 by the weight of polycycloolefin (solid state) to a base. A solvent is removed by evaporation at a temperature not more than an activating temperature of the stiffener. Next, the impregnated substrate is laminated with a conductive foil and polycycloolefin crosslinks into an insoluble state to activate the stiffener to show a grass transition temperature over 90 deg.C. A circuit board obtained like this is satisfactory in a dielectric constant and dielectric tangent. Thereby a stable print circuit board showing a physical characteristic satisfactory in a low solvent swelling degree, a low linear expansion coefficient, etc., is manufactured by this.
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