RADIATING STRUCTURE OF HEAT-GENERATING COMPONENT MOUNTED ON PRINTED-CIRCUIT BOARD

摘要

PURPOSE:To reduce a rise in temperature of a heat-generating component without increasing a mounting height of a component on a printed-circuit board by a method wherein one end face of a radiating component is in contact closely to the side of a printed-circuit board of the heat-generating component to be attached to the printed-circuit board and the opposite side of the radiating component is attached to printed-circuit board. CONSTITUTION:A radiating component is constituted of the following: a spacer part 1 of an insulator or a metal which has been treated to be insulating; radiating leads 2, of a radiating part, which are soldered to a printed-circuit board 6 and which conduct heat; solder vent grooves 3 which have been formed in the spacer part 1 in order to liberate the air in a space at the upper part of the printed-circuit board 6 because the air at the upper part cannot escape and a solder cannot rise when the spacer part 1 exists at the upper part of the printed-circuit board 6 during a soldering operation of the radiating leads 2. Heat which is generated from a heat-generating component 7 attached to the printed-circuit board 6 is conducted to the radiating component contacted closely at the end face and to the printed- circuit board 6 from the radiating component, and is radiated to an atmosphere. When the radiating component is attached in a gap between the heat-generating component 7 and the printed-circuit board 6, it is possible to lower a temperature of the heat-generating component 7 without increasing a height of the component.