Mounting structure for a surface-mounted-type component, and method of mounting a component of this type on a printed-circuit board

摘要

In this mounting structure and method for a surface mounted type electronic component (41), the component (41) has at least one terminal (36,34,36',34') which protrudes from its bottom surface and which terminates in a foot portion (36a,34a,36'a,34'a) for being soldered to a printed circuit board (43). Also, a projection (5) extends from this bottom surface of the electronic component for a distance (B) somewhat less than the amount by which the terminal (36,34,36',34') projects from it. This projection is provisionally secured by adhesive (45) to the printed circuit board (43) with the foot portion (36a,34a,36'a,34'a) of the terminal (36,34,36',34') overlaying that circuit portion (44) to which it is to be soldered, and then subsequently this terminal foot portion (36a,34a,36'a,34'a) is soldered to this circuit portion (44). The projection (5) may extend from a central portion of the bottom surface of the component (41), or may be provided in plurality as extending from central portions of edges of said bottom surface. And the end of the projection may be roughened.