Method and apparatus for testing unpackaged integrated circuits in a hybrid circuit environment

摘要

An apparatus for use in testing an integrated circuit in its intended operating environment with­in a hybrid circuit includes a hybrid circuit of the type within which the integrated circuit is to operate when subsequently mounted thereon. An aperture is formed in a hybrid substrate of the hybrid circuit in a location where the integrated circuit would otherwise be mounted, and a dielec­tric membrane is clamped over the aperture. Con­ductive bumps in the underside of the periphery of the membrane engage conductors on the upper surface of the hybrid substrate surrounding the aperture which conductors would normally connect to termi­nals of the integrated circuit. Conductive bumps on the under side of a central area of the membrane engage contact areas on the contact face of an integrated circuit under test situated therebelow and a plurality of conductor runs supported by the membrane extend from the conductive bumps in the central area of the membrane to the conductive bumps in the periphery of the membrane, thereby electrically interconnecting the integrated circuit under test to the hybrid circuit.