PROCESS FOR COATING METAL SUBSTRATES USING A POWDER PRIMER AND A DIP APPLIED COATING, POWDER PRIMER COMPOSITIONS USED AND COMPOSITE MATERIALS OBTAINED

摘要

The present invention relates to the field of coatings of metal substrates applied by dipping. It relates to a method of coating a metal substrate using a surface coat applied by dipping after coating of said substrate with a powder primer. It also relates to powder compositions which can be used as adhesion primer, as well as to composite materials: metal substrates/adhesion primer/surface coat.