A method for the coating of metallic carrier materials with a powder primer substance and a tauch applied surface coating compositions of the primer coating being used powder and the resulting composite materials

摘要

The present invention relates to the field of coatings of metal substrates applied by dipping. It relates to a method of coating a metal substrate using a surface coat applied by dipping after coating of said substrate with a powder primer. It also relates to powder compositions which can be used as adhesion primer, as well as to composite materials: metal substrates/adhesion primer/surface coat.