首页> 外国专利> Monolithic fabrication techniques for front face optoelectronic couplers and/or optical components including ridge structured waveguides

Monolithic fabrication techniques for front face optoelectronic couplers and/or optical components including ridge structured waveguides

机译:用于正面光电耦合器和/或包括脊结构波导的光学组件的单片制造技术

摘要

The invention involves a method for the monolithic fabrication of front face optoelectronic couplers and/or optical components (10) including a ridge structured waveguide (4) in which the light-coupling edges (2) of the component (10) using a mask in the desired structure are etched out of a wafer (1) of suitable material. With this method not only the light-coupling edges (2) of the component (10) but also the ridge waveguides (4) are readily fabricated in monolithic technology. To this end, the invention provides that the etched grooves (3) forming the light- coupling edges (2) with their side walls are covered with a first layer (5) of organic material which subsequently is removed outside the groove (3) so that the remaining residue at least nearly fills the etched groove (3), and that subsequently over the first a second layer (6) of organic material is applied which after appropriate treatment is used as etching mask for etching the predetermined ridge waveguide structure (4) out of the wafer (1). This method is particularly especially useful in the fabrication of MCRW (metal cladded ridge waveguide) lasers.
机译:本发明涉及一种用于整体制造正面光电耦合器和/或光学部件(10)的方法,该光学光电耦合器和/或光学部件(10)包括脊结构的波导(4),在该结构中,部件(10)的光耦合边缘(2)使用掩模形成。从合适材料的晶片(1)中蚀刻出所需的结构。利用这种方法,不仅可以容易地以整体技术制造部件(10)的光耦合边缘(2),而且可以容易地制造脊形波导(4)。为此,本发明提供了形成光耦合边缘(2)及其侧壁的蚀刻凹槽(3)覆盖有有机材料的第一层(5),随后将其去除到凹槽(3)的外部。剩余的残留物至少几乎填满了蚀刻的凹槽(3),然后在第一层上施加了第二有机材料层(6),经过适当处理后,该第二层用作蚀刻掩模以蚀刻预定的脊形波导结构(4) )从晶圆(1)中取出。该方法在制造MCRW(金属包覆的脊形波导)激光器时特别有用。

著录项

  • 公开/公告号US4895615A

    专利类型

  • 公开/公告日1990-01-23

    原文格式PDF

  • 申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;

    申请/专利号US19890319010

  • 发明设计人 MARKUS MUSCHKE;

    申请日1989-03-03

  • 分类号H01L21/306;B44C1/22;C03C15/00;C03C25/06;

  • 国家 US

  • 入库时间 2022-08-22 06:08:01

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