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Low-cost semiconductor device package process
Low-cost semiconductor device package process
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机译:低成本半导体器件封装工艺
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摘要
An adhesive composition for attaching semiconductor die to a substate of a semiconductor device package includes a crosslinkable resinous polyimide, and an aminosilane cross-linking agent. For applications where backside contact to the semiconductor die is desired, the composition also contains finely divided conductive metal, such as silver flakes. When used in a novel process in which the adhesive composition is placed on the semiconductor device substrate prior to gelling, outgassed, a semiconductor die is placed on the outgassed composition, and the composition cured, the resulting semiconductor device package meets military specifications with a substantial cost reduction.
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