DEVICE AND METHOD FOR DETECTING DEFECT WHICH IS CARRIED VERTICALLY IN INTEGRATED CIRCUIT

摘要

PURPOSE: To detect any defect in an integrated circuit by forming a vertical double bridge test structure including a first test structure (lower part) and a second test structure (upper part). CONSTITUTION: A first meandering part 14 on a substrate 10 is constructed as a high electric resistance having a predetermined number of intermediate segments 16, and each strip end of a highly conductive first set strips 32 insulated from the first meandering part 14 and separated in a non-overlapping relation is connected with an intermediate segment 16 end corresponding to the first meandering part 14 to form a first test structure 48. A second meandering part 24 is constructed as a high electric resistance having a predetermined number of intermediate segments 26, and each strip of a highly conductive second set strip 62 insulated from the second meandering part 24 is matched with each one corresponding to the intermediate segments 26 of the second meandering part 24 in an overlapping relation and each end is electrically joined with the intermediate segment 26 end corresponding to the first meandering part 14 to construct a second test structure. 76. Hereby, any defect in a semiconductor circuit is detected, and yield prediction and estimated efficiency are improved.