Apparatus and method for detecting vertically propagated defects in integrated circuits

摘要

Vertically propagated defects in integrated circuits are detected utilizing an apparatus which includes a first meander structure formed on or in a substrate and a second meander structure electrically insulated from the first meander. Each meander includes intermediate segments, the ends of which are interconnected by folded segments. A first set metal of strips are electrically insulated from the first and second meanders. The ends of each strip in the first set are electrically connected to the ends of a corresponding intermediate segment of the first meander. A second set metal or strips are electrically insulated from the first set of strips, the first meander and the second meander. The ends of each strip in the second set are electrically connected to the ends of a corresponding intermediate segment of the second meander and at least a portion of the second set of strips overlies at least a portion of the first set of strips.