hermetically gekapseltes, a leistungschip containing part

摘要

A hermetic power chip package comprises a dielectric plate (18) having at least a first electrode (20, 22, 24) bonded to a lower surface of the plate, a corresponding conductive lead bonded to an upper surface of the plate, and at least one conductive through hole interconnecting the electrode and the lead, a power chip (16) having at least a first terminal (34, 36) on its upper side bonded to the first electrode and a terminal (38) on its lower side, and a lower electrode (17) in the form of a conductive sheet bonded to the lower terminal (38) and hermetically sealed to the dielectric plate 18 through a metallic sealing ring (42). IMAGE