method for assembling an integrated circuit on a porter, resulting arrangement and its application in an electronic mikroschaltungskarte.

摘要

A device in the form of a contact assembly or package (10) for use in a card (26), such as a credit card. The package includes a substrate (11) having contact holes (16) extending therethrough. The holes are covered by a metal layer (15) on the substrate. Terminals (14) of an integrated circuit (12) are soldered to the metal layer (15) through the holes (16) of the substrate (11). The terminals have a height approximately equal to the thickness of the substrate (11).