Acousto-electronic component with surface wave substrate - has integrated semiconductor circuit, whose substrate covers surface wave structures

摘要

The component has a support (2) as a surface wave substrate, and an electronic integrated semiconductor circuit in a housing (2,13). The substrate (50) of the integrated semiconductor circuit also forms a cover of the surface wave transducer structures (161,162). The cover has a peripheral frame (13), sufficiently rated for the function of the surface wave structure. The two substrates (2,50) and the peripheral frame are hermetically interconnected to form a housing for the surface wave structure. Pref. the cover also abuts the pads of the transducer structures. At the abutment points are through contacts in the cover for sealed electric connection of the pads (63). ADVANTAGE - Improved encapsulation of low-cost structure.