Method and apparatus for the thin film deposition of materials with a high power pulsed laser

摘要

The present invention provides an apparatus and method for laser direct writing of materials onto a receiving substrate using a high power pulsed laser. The invention includes a pulsed laser light source, a receiving substrate, disposed opposite the pulsed laser light source, and an optically transparent source support substrate positioned between the receiving substrate and the pulsed laser light source, wherein a surface of the optically transparent source support substrate facing the receiving substrate has coated thereon a thin film of material to be deposited on the receiving substrate. Laser direct writing using the invention is accomplished by impinging the thin film of material with a pulsed laser light from the pulsed laser lightPPSTATEMENT OF GOVERNMENT INTERESTPPThe Government has rights in this invention pursuant to Contract No. N00024-85-C-5301 awarded by the Department of the Navy.