METHOD OF CONNECTING EXTERNAL TERMINAL OF SEMICONDUCTOR DEVICE USING COVERED WIRE

摘要

PURPOSE:To rigidly protect connection of a secondary side connector by a ball bump and to improve reliability of the connector by wire bonding by using a covered wire, and then forming the bump at the connector. CONSTITUTION:A capillary is moved to a secondary side connector 5, i.e., an external connector side while drawing a covered wire, and the connector is connected. Then, the wire is rubbed with a lead frame 2 at the end of the capillary to remove its insulating film, and connected. Thereafter, a ball bump 4 is formed by a similar method to that of forming the bump by an electric discharge, etc., for a primary side connection to reinforce the connector connected by rubbing. Since the connector is protected by the bump 4, an extremely rigid connecting state can be obtained.