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ELECTRONIC PART MOUNTING JIG AND ELECTRONIC PART SOLDERING METHOD USING THE JIG

机译:电子零件安装夹具及使用该夹具的电子零件焊接方法

摘要

PURPOSE:To prevent soldering failure from being produced by providing a housing part for housing a body part of an electronic part and a press part for pressing each lead terminal of the electronic part, and further providing a solder paste storage part in the press part. CONSTITUTION:There are provided in a rectangur block a recessed housing part 11 in which a body part 4a of an electronic part 4 is housed, and a press part for pressing a lead terminal 4b of the electronic part 4. There are further provided in the press part 12 a plurality of solder paste storage parts 13 opened toward the side of a lead terminal press surface 12a of the press part 12. The lead terminal 4b of the electronic part 4 is pressed with the weight of a jig 10 against an electrode part 2 of a board 1 through the lead terminal press surface 12a to correct the floating between the lead terminal 4b and the electrode part 2 of the board 1. When the require amount of the solder paste 3 is put in the solder paste storage part 13, the solder is prevented from being forced out after being heated. Thus, soldering work can be secured.
机译:用途:为防止焊接失败,方法是提供一个用于容纳电子部件的主体部分的外壳部分和一个用于按压电子部件的每个引线端子的按压部分,并在按压部分中进一步提供焊膏存储部分。构成:在一个矩形块中,提供了一个凹进的外壳部分11和一个用于压迫电子部分4的引线端子4b的压紧部分,该凹入的外壳部分11中容纳有电子部件4的主体部分4a。按压部12具有向着按压部12的引线端子按压面12a侧开口的多个焊锡膏收纳部13。利用夹具10的重量将电子部件4的引线端子4b按压在电极部上。如图2所示,通过引线端子按压面12a使基板1的图2所示的端子2a与基板1的电极部2之间的浮起校正。将需要量的焊锡膏3投入到焊锡膏收纳部13中时。防止了加热后焊料被挤出。因此,可以确保焊接工作。

著录项

  • 公开/公告号JPH04199896A

    专利类型

  • 公开/公告日1992-07-21

    原文格式PDF

  • 申请/专利权人 MITSUBISHI ELECTRIC CORP;

    申请/专利号JP19900336164

  • 发明设计人 KASATANI TAIJI;

    申请日1990-11-29

  • 分类号H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-22 05:44:29

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