METHOD FLATTENING DERIVATIVE FORMED ON SEMICONDUCTOR SUBSTRATE AND ITS DEVICE

摘要

PURPOSE: To provide a method and a device for flattening the surface of a dielectric, deposited on a semiconductor wafer. CONSTITUTION: The wafer is press-contacted downward on a table 20 covered with an abradant. Thus, the upper surface of the inter-layer dielectric is contacted with the abradant. By rotationally moving the wafer with respect to the table, the protruding section of an inter-layer dielectric 14 can be easily removed by the abradant. After flattening, the difference in the height of steps is suppressed to a minimum by simultaneously cooling the table and the abradant during a polishing process.