METHOD FOR MULTIMOLDING OF MOLDED PART IN ELECTRONIC COMPONENT LEAD FRAME

摘要

PURPOSE:To reduce cost required for molding of a molded part and to uniform quality by sliding a lead frame off by an appropriate dimension in the longitudinal direction of the lead frame. CONSTITUTION:When arranged in parallel between a lower die 11 and an upper die, the lead frames A, B are slid off each other in the longitudinal direction by appropriate dimension L. Then, the cast opening 16a of each molding cavity 16 of one lead frame A and the cast opening 17a of each molding cavity 17 of the other lead frame B approaches each other along the longitudinal direction of the lead frames A, B; therefore, runners 18, 19 which connect each stock tablet filling chamber 13 to cast openings 16a, 17a of the respective molding cavities 16, 17 in the lead frames A, B can be shortened markedly.