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PIN GRID ARRAY-PACKAGE

机译:PIN码网格包装

摘要

PURPOSE:To stabilize and increase joint strength between a package substrate and a nail head pin, and to improve productivity by forming the shape of the head of the nail head pin joined with an electrode pad in a conical shape using a joint surface with the electrode pad as a base. CONSTITUTION:Conical heads 11a are formed at one ends of nail head pins 11 joined with each electrode pad 3 of a package substrate 2 and composed of an iron-nickel group alloy, and a wax material 4 as a joint material is applied to the heads 11a. Load shown in an arrow (b) is applied to the nail head pin 11 from the upper section of the nail head pin by positioning a weight on the projecting end section side of the nail head pin 11, but the molten wax material 4 pushed out from the pushing surface of the head 11a spreads toward the side face of the head 11a and the peripheral section of the electrode pad 3 at that time. When the wax material 4 is solidified, stress (f) capable of being broken down into a vector f1 in the horizontal direction and a vector f2 in the vertical direction is generated in the direction of a wetting angle theta, and the vector f2 in the vertical direction can be diminished by reducing the wetting angle theta.
机译:目的:通过使用与电极的接合面,使与电极垫接合的钉头销的头部形状为圆锥形,从而稳定并提高封装基板与钉头销之间的接合强度,并提高生产率。垫为基础。组成:圆锥形头部11a形成在与封装基板2的每个电极焊盘3相连的钉头销钉11的一端,钉子销钉11由铁-镍基合金构成,并且将蜡质材料4作为接合材料施加到钉头上11a。通过将重量放置在钉头销11的突出端部侧上,从钉头销的上部向钉头销11施加箭头(b)所示的载荷,但是熔融蜡材料4被推出此时,从头部11a的推动表面开始的“接触”部分向头部11a的侧面和电极焊盘3的周边部分扩展。当蜡材料4固化时,在润湿角θ的方向上产生能够分解为水平方向上的矢量f1和垂直方向上的矢量f2的应力(f),并且在该方向上产生矢量f2。垂直方向可以通过减小润湿角θ来减小。

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