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Integrated circuit with a selection device for connecting an internal circuit with one of a majority of signal circuit strips
Integrated circuit with a selection device for connecting an internal circuit with one of a majority of signal circuit strips
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机译:带有选择装置的集成电路,用于将内部电路与大多数信号电路条之一连接
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摘要
A semiconductor device formed on a semiconductor chip (1) comprises a plurality of first bonding pads (3a, 3d) for receiving an identical external signal, an internal circuit (8) connected to any one of the plurality of the first bonding pads, a second bonding pad (11) for receiving a control signal from outside the semiconductor chip, and a bonding pad selection switch (19) for selecting a bonding pad out of the plurality of first bonding pads and connecting it to the internal circuit in response to the control signal supplied thereto through the second bonding pad.
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