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Fluxless resoldering system and fluxless soldering process
Fluxless resoldering system and fluxless soldering process
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机译:无助焊剂重新焊接系统和无助焊剂焊接工艺
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摘要
A fluxless reflow soldering processing and system having a reactive inert gas control arrangement coupled to a conventional reflow soldering head for enabling solder to wet metallic surfaces for joining purposes. The gas control arrangement includes a set of gas regulating valves and heat exchange units for supplying selected quantities of inert gases under pressure at various temperatures to a soldering area during the soldering process. The inert gases are employed to clean the soldering area of metal oxides and are used to facilitate the forming of a reliable solder joint by inhibiting the formation of metal oxides and by helping to cool down the solder joint in a substantially uniform manner.
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