METHOD FOR INHIBITING WARPAGE OF WAFER DURING FORMATION OF POLYCRYSTALLINE FILM ON WAFER

摘要

PURPOSE:To inhibit the warpage of a wafer put on a support without causing waving by pressing a circular pressing plate against the top of the periphery of the wafer with a circular elastic body in-between. CONSTITUTION:A wafer 4 is put on a support 2 set in an inert gas atmosphere 1 and a circular pressing plate 7 is placed on the wafer 4 with a circular elastic body 10 in-between and pressed against the top of the periphery of the wafer 4 with clamping screws 8. The plate 7 has an opening 7a whose size is equal to the size of the opening 10a in the elastic body 10. The support 2 is then heated with a heating source 3 and rotated, particles 5 of sprayed molten silicon are deposited on the wafer 4 and the resulting molten silicon layer 6 is cooled to form a polycrystalline layer 6a.