RESIST COATING DEVICE AND METHOD FOR SPIN-COATING WITH RESIST

摘要

PURPOSE: To suppress the generation of turbulent flow caused by high-speed rotation in spin-coating, and to realize uniform thickness of resist. ;CONSTITUTION: While holding a wafer 11 with a wafer chuck 10, a circular plate 13, which is rotated by a motor 12, is disposed above the wafer 11, in parallel with the wafer 11 and nearby the wafer 11. The distance between the circular plate 13 and the wafer 11 is 0.5mm, and the number of rotations and the rotating direction of the circular plate 13 are the same as those of the wafer 11. In the case of a wafer of 8-inch diameter, turbulent flow does not generate even at a rotational speed of above 4,000r/min, and ununiformity of the film thickness can be suppressed. At this time, varying range of uniformity of the film thickness is 4.0nm (40Å). The number of rotations of the circular plate 13 can be lower than that of the wafer 11 within the range of |ω₁-ω₂|=(ν/r₀²)×2.15×10⁵.;COPYRIGHT: (C)1993,JPO&Japio