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MANUFACTURING METHOD OF RADIATION-HARDENED HIGH-SPEED LOW-LEAKAGE CMOS/SOI DEVICE

机译:辐射抑制型高速低泄漏CMOS / SOI器件的制造方法

摘要

PURPOSE: To manufacture a radiation-hardened high-speed low-leakage semiconductor device, which is actuated stably even in the environment with radioactive rays. ;CONSTITUTION: A substrate 10 of SIMOX (separation due to an oxygen ion- implantation) with silicon islands 18 and 20 is used, whereby the groups of N-channel and P-channel devices which are separated from each other are respectively formed on the respective silicon islands, a thin silicon oxide layer 14 is applied thereon and, moreover, phosphoborosilicate glass films 34a are deposited, the films 34 are reflowed, contact places 56 are formed by etching, and the final wiring is provided.;COPYRIGHT: (C)1993,JPO
机译:目的:制造一种辐射硬化的高速低泄漏半导体器件,即使在有放射线的环境中也能稳定地致动。 ;构成:使用具有硅岛18和20的SIMOX(由于氧离子注入而导致的分离)的衬底10,由此在衬底上分别形成彼此分离的N沟道和P沟道器件的组。分别在硅岛上涂覆一层薄的氧化硅层14,然后沉积磷硼硅酸盐玻璃膜34a,使膜34回流,通过蚀刻形成接触点56,并提供最终的布线。 1993年

著录项

  • 公开/公告号JPH05152527A

    专利类型

  • 公开/公告日1993-06-18

    原文格式PDF

  • 申请/专利权人 HUGHES AIRCRAFT CO;

    申请/专利号JP19900414853

  • 发明设计人 CHANG CHEN-CHI P;LI MEI;

    申请日1990-12-27

  • 分类号H01L27/092;H01L27/12;

  • 国家 JP

  • 入库时间 2022-08-22 05:17:18

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