CHIP PUSH-UP APPARATUS FOR DIE BONDING USE

摘要

PURPOSE: To maintain the smooth and stable up-and-down movement function of a chip push-up pin for a long time and to move wafer ring to an arbitrary position as required by a method wherein nearly the whole of the chip push-up pin is constituted so as to be moved up and down while it is shaken inside a cylindrical guide holder. ;CONSTITUTION: When a pulse motor 21 is turned and controlled by a chip push-up instruction, a uniform-velocity curved cam 22 is shaken. A chip push-up pin 13 is moved upward by the coupling of the cam 22 to a cam follower 23 and by the energizing force of a spring 19 while it is being shaken on the inner circumferential face of a guide holder 14. A chip which is to be die-bonded is pushed up and pressed to the suction face of a suction nozzle. At this time, the guide holder 14 is not subjected to any inessential movement because the chip push-up pin 13 is moved up and down on the same axis. When a wafer 1 replaced, the guide holder 14 is moved downward by using a bearing 15 and its tip part is made to protrude to the outside of a wafer ring 2. Thereby, the replacement operation of the wafer 1 can be performed easily.;COPYRIGHT: (C)1993,JPO&Japio