首页> 外国专利> ANALYSIS OF IMPURITY ON COMPOUND SEMICONDUCTOR SUBSTRATE SURFACE THROUGH SECONDARY ION MASS SPECTROMETRY AND ANALYSIS OF IMPURITY IN AIR

ANALYSIS OF IMPURITY ON COMPOUND SEMICONDUCTOR SUBSTRATE SURFACE THROUGH SECONDARY ION MASS SPECTROMETRY AND ANALYSIS OF IMPURITY IN AIR

机译:通过二次离子质谱法分析复合半导体基质表面的杂质和空气中的杂质

摘要

PURPOSE: To analyze the impurity on the surface of a substrate in quantitatively with high precision by forming a cap layer having the same composition to that of a compound semiconductor substrate on the substrate and carrying out the secondary ion mass spectrometry. ;CONSTITUTION: A cap layer 3 which essentially has the same composition to that of a substrate 1 is formed on a compound seeconductor substrate 1, and the secondary ion mass spectrometry is carried out from the surface of the cap layer 3 at least to the interface between the cap layer 3 and the substrate 1. Further, a contaminating impurity layer 2 is formed on the substrate 1, and the thickness of the cap layer 3 is set to about 100-300μm in order to prevent the peak of the impurity which is obtained by the analysis from being too broad and prevent the initial effect from being suppressed insufficiently. Accordingly, the impurity on the surface of the substrate 1 can be analyzed quantitatively with high precision.;COPYRIGHT: (C)1993,JPO&Japio
机译:目的:通过在基底上形成与化合物半导体基底具有相同组成的盖层,并进行二次离子质谱分析,以高精度定量分析基底表面上的杂质。 ;组成:在化合物导电导体基板1上形成与基板1具有基本相同组成的覆盖层3,并且从覆盖层3的表面至界面至少进行二次离子质谱分析。在覆盖层3和基板1之间形成有杂质杂质层2。此外,为了防止作为杂质的峰值,覆盖层3的厚度被设定为100〜300μm左右。通过分析获得的结果过于宽泛,并不能充分抑制初始效果。因此,可以高精度地定量分析基板1的表面上的杂质。COPYRIGHT:(C)1993,JPO&Japio

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