MANUFACTURE OF HIGH-TEMPERATURE RESISTING POSITIVE RESIST AND HIGH-TEMPERATURE RESISTING RELIEF STRUCTURE

摘要

PURPOSE: To enhance storage stability by using an oligomer or polymer benzoxazole precursor and diazoquinone as a base and converting them into a specified hydroxypolyamide. CONSTITUTION: The high heat sensitive positive resist made from as a base the diazoquinone and the oligo- or poly-benzoxazole precursor represented by the formula in which each of R', R1 , R1 ', and R2 is an aromatic group; R3 is an aliphatic or alicyclic or aromatic group having at least one alkenyl or alkynyl group; and each of n1 -n3 is as follows; n1 is 1-100, n2 =0, and n3 =0; or n1 =1-100, n2 =1-100, n3 =0; n2 =1-100, n1 =0, n3 =0; n1 -n3 =1-100 (but RR' and/or R1 R1 ') or n1 =1-100, n3 =1-100, and n2 =0 (but RR' and/or R1 R1 ') (but n1 +n2 +n3 =3).