Manufacturing method of high heat resistant positive resist and high heat resistant relief structure

摘要

Inexpensive high-temperature-resistant positive resists based on oligomeric and/or polymeric polybenzoxazole precursors and diazoquinones have a high storage stability if the polybenzoxazole precursors are hydroxypolyamides having the following structure: IMAGE where R, R*, R1, R1* and R2 are aromatic groups, R3 is an aliphatic, cycloaliphatic or aromatic group containing at least one alkenyl or alkynyl group, and the following applies to n1, n2 and n3: n1 = 1 to 100, n2 and n3 = 0, or n1 and n2 = 1 to 100, n3 = 0, or n2 = 1 to 100, n1 and n3 = 0, or n1, n2 and n3 = 1 to 100 (where R NOTEQUAL R* and/or R1 NOTEQUAL R@), or n1 and n3 = 1 to 100, n2 = 0 (where R NOTEQUAL R* and/or R1 NOTEQUAL R@), with the proviso that n1 + n2 + n3 /= 3.s