Heat-resistant positive resist and method for manufacturing heat-resistant relief structure

摘要

The invention provides heat-resistant positive resists and methods for preparing heat-resistant relief structures therefrom. The positive resists are based upon polybenzoxazole precursor stages and diazoquinones. The polybenzoxazole precursor stages are hydroxypolyamides with the following structure: IMAGE where R, R*, R1 and R1* are aromatic groups; n1 and n2=1 to 100; and R NOTEQUAL R* and/or R1 NOTEQUAL R1*.