DIRECT LASER IMAGING FOR THREEDIMENSIONAL CIRCUITS AND THE LIKE

摘要

In a method for fabricating a printed circuit board on a doubly contoured or hemispherical substrate such as a radome, a coherent light source is used to form a plurality of elements of a predetermined pattern on the surface of the substrate. The coherent light source preferably includes an excimer laser. The substrate includes a bottom layer and a metallized layer which is covered by a photoresist coating. The first element of the pattern is formed by directly imaging the element in the photoresist coating. The substrate is then displaced relative to the coherent light source until all the elements of the predetermined pattern are formed in the photoresist coating over the entire surface of the substrate. After the pattern is complete and the photoresist is developed, an etching technique is used to remove portions of the metallized layer from the substrate.