ENVIRONMENTALLY PROTECTED SEMICONDUCTOR CHIP PACKAGE

摘要

LOW-COST HIGH-PERFORMANCE SEMICONDUCTOR CHIP PACKAGEAbstract of the DisclosureDisclosed is a low-cost high-performancesemiconductor chip package enabling a direct chip to printedcircuit board connection. The package comprises asemiconductor chip having a front surface and a back surface.The front surface comprises pads for input and output ofsignals to and from the chip. The package further comprisesa leadframe having power, ground, and signal conductiveelements having first and second end portions fortransmitting input and output signals to the pads. Thepackage also comprises a bonding system for selectivelyconnecting the first end portions of the conductive elementsto the pads and a protective system for providing sealed andenvironmental protection around the semiconductor chip andportions of the leadframe while permitting other portions ofthe leadframe to protrude from the protective means toprovide connection with other devices.