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An apparatus for chamfering the peripheral edge of a wafer to specular finish

机译:一种将晶片的外围边缘倒角至镜面光洁度的设备

摘要

An apparatus for chamfering the peripheral edge of a semiconductor wafer to specular finish, consisting of a turn table with an abrasive table surface, and a wafer holder, which holds the wafer firmly by sucking one face of the wafer, turn the wafer circumferentially, and press the wafer edge against the abrasive table surface in a manner such that the edge of the wafer is brought and kept in contact with the table surface in a way such that the triangle formed by the center of the turn table surface, the center of the wafer and said contact point is normal to the turn table surface and the angle formed between the turn table surface and the wafer is at the beginning substantially close to 0° but said angle is continuously or stepwise increased to a value substantially close to 180° , and the wafer holder also moves the wafer in a way such that the contact point is moved on the turn table surface.
机译:一种用于将半导体晶片的外围边缘倒角成镜面光的装置,该装置包括具有研磨台表面的转台和晶片保持器,该晶片保持器通过抽吸晶片的一个面来牢固地固定晶片,使晶片周向转动,以及将晶片边缘压在研磨台表面上,使晶片的边缘与研磨台表面接触并保持接触,使三角形由转台表面的中心,晶片和所述接触点垂直于转台表面,并且转台表面与晶片之间形成的角度在开始时基本上接近0°,但是所述角度连续或逐步增加到基本上接近180°的值,晶片保持器还以使接触点在转台表面上移动的方式移动晶片。

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