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A probing apparatus having an automatic probe card installation mechanism and a semiconductor wafer testing system including the same

机译:具有自动探针卡安装机构的探测设备和包括该探测设备的半导体晶片测试系统

摘要

A probing apparatus including probes contacting with electrode pads of the semiconductor wafer for measuring a semiconductor wafer in which a probe card is safely and individually installed and a wafer testing system in which a plurality of probe cards are efficiently used are disclosed. A probing apparatus includes moving means 4 for receiving a card holder 2 accommodating a probe card 1, moving the card holder 2 into a position just below a pogo pin socket 3 to which the probe card 1 is attached, and lifting the card holder 2, and attaching means 5 for attaching the probe card 1 to the pogo pin socket 3.
机译:公开了一种探测装置,该探测装置包括与半导体晶片的电极焊盘接触以测量半导体晶片的探针,其中安全且单独地安装有探测卡,并且该探测装置有效地使用了多个探测卡。一种探测装置,包括用于容纳容纳探针卡1的卡夹2的移动装置4,将卡夹2移动到正好安装有探针卡1的pogo pin插座3下方的位置,并抬起卡夹2,固定装置5,用于将探针卡1固定在弹簧针插座3上。

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