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Semiconductor pressure sensor with enhanced overload resistance - is protected by overlap of edge of diaphragm giving relief of tension under excessively high pressure

机译:具有增强的抗过载能力的半导体压力传感器-膜片边缘重叠保护,在过高压力下释放张力

摘要

The diaphragm (6) extends between a recess (4) in the rear of a first semiconductor body (2) and a chamber (12) formed by a recess (9) in a second semiconductor body (3), sepd. from the first (2) by a nonconductive intermediate layer (11). The diaphragm (6) overlaps edges (13) of this layer (11) to relieve tension at its own edges (24) when deformed (6'). Deflection of the diaphragm is measured by capacitive electrodes on its face and on the opposite surface (14). ADVANTAGE - Excess pressures of more than 100 times max. measured value can be withstood with diaphragm compressed instead of being stretched.
机译:隔膜(6)在第一半导体本体(2)后部的凹部(4)和第二半导体本体(3)中的凹部(9)形成的腔室(12)之间延伸。通过非导电中间层(11)从第一(2)开始。隔膜(6)与该层(11)的边缘(13)重叠,以在变形(6')时减轻其自身边缘(24)上的张力。膜片的挠曲由其表面和相对表面(14)上的电容性电极测量。优势-超压超过最大100倍。膜片压缩而不是拉伸即可抵挡测量值。

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