首页> 外国专利> Local copper@ deposition from organo:metallic film on substrate - by forming film from mixt. of copper acetate and copper formate in specified ratio and depositing film by laser irradiation

Local copper@ deposition from organo:metallic film on substrate - by forming film from mixt. of copper acetate and copper formate in specified ratio and depositing film by laser irradiation

机译:通过在混合液中形成薄膜,在基板上的有机金属薄膜上局部沉积铜。比例照射乙酸铜和甲酸铜并沉积膜

摘要

For local Cu deposition from an organo-metallic film on a substrate, the film is formed from a mixt. of Cu acetate and Cu formate in a ratio of 1:5 acetate:formate. The mixt. forms an amorphous film. Deposition is caused by laser beam irradiation. USE/ADVANTAGE - Used partic. for forming conductor tracks on printed circuit boards to electronic units. Film is easily applied, retains amorphous state over long periods.
机译:为了从基底上的有机金属膜中局部沉积铜,该膜由混合物形成。乙酸铜和甲酸铜的比例为1:5的乙酸盐:甲酸盐。混音。形成非晶膜。沉积是由激光束照射引起的。使用/优势-二手。用于在印刷电路板上形成至电子单元的印制导线。薄膜很容易使用,可以长期保持非晶态。

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