Semiconductor device with semiconductor elements in substrate - has metal wiring layer in region between semiconductor elements and evaluation device insulated from wiring layer for investigation of electrical characteristics

摘要

In the substrate several semiconductor elements (3) are formed. There is a wiring region (8) between the semiconductor elements, in which is formed a metal wiring layer for the electric connection of the semiconductor elements. Under the wiring region an evaluation device is formed , insulated from the metal wiring layer, capable of examination of an electric characteristic. An evaluation metal wiring layer independent of the above metal wiring layer is coupled to an electrode region of the evaluation device . An evaluation connecting face (16) is electrically connected to the evaluation metal wiring layer for forming external electric contact. USE/ADVANTAGE - For test element groups on single wafer, with simplified comparison and testing method.