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Method of manufacturing a p-type compound semiconductor thin film containing a III-group element and a v-group element by metal organics chemical vapor deposition

机译:通过金属有机物化学气相沉积制造包含III族元素和v族元素的p型化合物半导体薄膜的方法

摘要

A p-type GaAs or AlGaAs thin film is formed by a MOCVD method. In the growing step of the thin film, the thin film is doped with a high concentration of carbon atoms forming an acceptor level such that the carrier concentration of the thin film falls within the range of between 1×10.sup.18 cm.sup.-3 and 1×10.sup.20 cm.sup.-3. At least one of trimethyl gallium and trimethyl aluminum is used as a raw material gaseous compound of III-group element, and arsine is used as a raw material gaseous compound of V-group element. The thin film is formed by an epitaxial growth under the molar ratio V/III of the V-group element supply rate to the III-group element supply rate, which is set at such a small value as 0.3 to 2.5, the temperature of 450 to 700° and the pressure of 1 to 400 Torr. The thin film formed under these conditions exhibits a mirror-like smooth surface, and the film-growth rate is dependent on the supply rate of the V-group element.
机译:通过MOCVD法形成p型GaAs或AlGaAs薄膜。在薄膜的生长步骤中,向薄膜中掺杂高浓度的碳原子,形成受体能级,从而使薄膜的载流子浓度落在1×10〜18 cm的范围内。 .-3和1×10 20厘米-3三甲基镓和三甲基铝中的至少一种用作III族元素的原料气态化合物,而砷化氢用作V族元素的原料气态化合物。通过在V族元素供给速率与III族元素供给速率的摩尔比V / III的摩尔比V / III下外延生长来形成薄膜,该V / III被设置为0.3至2.5的小值,温度为450至700°和1至400托的压力。在这些条件下形成的薄膜呈现出镜面般的光滑表面,并且膜生长速率取决于V族元素的供给速率。

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