首页> 外国专利> METAL-ORGANIC VAPORIZING AND FEEDING APPARATUS, METAL-ORGANIC CHEMICAL VAPOR DEPOSITION APPARATUS, METAL-ORGANIC CHEMICAL VAPOR DEPOSITION METHOD, GAS FLOW RATE REGULATOR, SEMICONDUCTOR MANUFACTURING APPARATUS, AND SEMICONDUCTOR MANUFACTURING METHOD

METAL-ORGANIC VAPORIZING AND FEEDING APPARATUS, METAL-ORGANIC CHEMICAL VAPOR DEPOSITION APPARATUS, METAL-ORGANIC CHEMICAL VAPOR DEPOSITION METHOD, GAS FLOW RATE REGULATOR, SEMICONDUCTOR MANUFACTURING APPARATUS, AND SEMICONDUCTOR MANUFACTURING METHOD

机译:金属有机汽化和进料装置,金属有机化学汽相沉积装置,金属有机化学汽相沉积方法,气体流量调节器,半导体制造装置和半导体制造方法

摘要

PROBLEM TO BE SOLVED: To provide a metal-organic vaporizing and feeding apparatus which can be simplified, metal-organic chemical vapor deposition apparatus, gas flow rate regulator, semiconductor manufacturing apparatus, and semiconductor manufacturing method.;SOLUTION: The metal-organic vaporizing and feeding apparatus includes a retention vessel 1 for retaining a metal-organic material 13, a bubbling gas feeding path 3 which is connected to the retention vessel 1 and feeds bubbling gas to the metal-organic material 13, a metal-organic gas feeding path 5 which is connected to the retention vessel 1 and feeds the organic metal gas produced in the retention vessel 1 and dilution gas to a deposition chamber, a dilution gas feeding path 7 which is connected to the metal-organic gas feeding path 5 and feeds the dilution gas to the metal-organic gas feeding path 5, a flow rate regulator 9 which is provided in the bubbling gas feeding path 3 and regulates the flow rate of the bubbling gas, a pressure regulator 11 which regulates the pressure of the dilution gas, and a sonic nozzle S which is disposed in the metal-organic gas feeding path 5 on a downstream side of a connecting position between the metal-organic gas feeding path 5 and the dilution gas feeding path 7.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种可以简化的金属有机物汽化和进料装置,金属有机物化学汽相沉积装置,气体流量调节器,半导体制造装置和半导体制造方法。供给装置包括:用于保持金属有机物13的保持容器1;与保持容器1连接并向金属有机物13供给气泡气体的气泡气体供给路径3;以及金属有机气体供给路径。如图5所示,稀释气体供给路径7与金属有机气体供给路径5连接,该稀释气体供给路径7与保留容器1连接,并将在保留容器1中产生的有机金属气体和稀释气体供给至沉积室。稀释气体进入金属-有机气体进料通道5,流量调节器9设置在气泡气体进料通道3中,并调节气泡气体的流量,压力调节器11,其调节稀释气体的压力;以及声波喷嘴S,其布置在金属有机气体进给路径5与稀释液之间的连接位置的下游侧的金属有机气体进给路径5中。供气通道7 .;版权所有:(C)2008,日本特许厅&INPIT

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