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High electron mobility transistor with GaN/Al.sub.x Ga.sub.1-x N heterojunctions
High electron mobility transistor with GaN/Al.sub.x Ga.sub.1-x N heterojunctions
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机译:具有GaN / Alx Ga1-x N异质结的高电子迁移率晶体管
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摘要
A high electron mobility transistor is disclosed, which takes advantage of the increased mobility due to a two dimensional electron gas occurring in GaN/Al.sub.x Ga.sub.1-x N heterojunctions. These structures are deposited on basal plane sapphire using low pressure metalorganic chemical vapor deposition. The electron mobility of the heterojunction is aproximately 620 cm.sup.2 per volt second at room temperature as compared to 56 cm.sup.2 per volt second at 180° K. and decreased to 19 cm. sup. 2 per volt second at 77° K. The mobility for the heterostructure, however, increased to a value of 1,600 cm.sup.2 per volt second at 77° K. and saturated at 4° K.
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机译:公开了一种高电子迁移率晶体管,其利用了由于在GaN / Al x Ga 1-x N异质结中出现二维电子气而增加的迁移率。使用低压金属有机化学气相沉积法将这些结构沉积在基面蓝宝石上。室温下,异质结的电子迁移率约为每伏秒620 cm·s 2,而在180°K时为每伏秒56 cm·s2,并降低到19 cm。一口在77°K时为2伏特/秒。但是,异质结构的迁移率在77°K时增加至1600 cm·s / v 2伏特,并在4°K时达到饱和。
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