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A semiconductor chip assembly, the component manufacturing method and a semiconductor chip assembly of the semiconductor chip assembly
A semiconductor chip assembly, the component manufacturing method and a semiconductor chip assembly of the semiconductor chip assembly
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机译:半导体芯片组件,组件制造方法和半导体芯片组件的半导体芯片组件
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摘要
Semiconductor chip assemblies incorporating flexible, sheetlike elements (42) having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals (48) on the sheetlike element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer (42) interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with test probe assembly so as to permit reliable engagement despite tolerances. IMAGE
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