PURPOSE:To obtain a method for improving the quality of wood hard to generate a crack, short in a treatment time and capable of suppressing the exudation of resin without losing gloss by subjecting wood to dielectric heating at temp. decomposing a part of the resin component of wood and condensing or polymerizing the other part thereof and subsequently subjecting the same to dielectric heating at temp. lower than that temp. CONSTITUTION:In dielectric heating, the heating temp. due to the dielectric heating of the first stage may be set to temp. necessary for oxidizing and decomposing a part of the resin components in wood to chemically change the same to a low- molecular component easy to volatilize and condensing or polymerizing the other part thereof to chemically change the same to a high-molecular component hard to move. The heating temp. is different for different type of resin but generally 60-120 deg.C. The heating temp. due to the dielectric heating of the second stage may be set to temp. capable of discharging the low-molecular component easy to volatilize among resin components to the outside of wood by an evaporation phenomena. This heating temp. is different for different type of resin but generally about 60 deg.C or lower. By this method, the exudation of resin is suppressed and the surface gloss of wood is not lost and a treatment time is made short to lower manufacturing cost.
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